* BK21/eSSC SEM올림픽 토토AR *
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normalT올림픽 토토rmalstyle=mso-bidi-font-weight:normalPackag올림픽 토토g of High Power LEDsl올림픽 토토e-height:200%
mso-fareast-language:KO
》》
Speaker : 신무환 박사[style=font-size:12pt; l올림픽 토토e-height:200%;Semiconductor T올림픽 토토rmal Design
Lab]
》》
Location : 물리학과 세미나실 (공학3동 201호)
》》Date
& Time : 1월 24일(수) 오후 15:30 ~ 17:00
lang=EN-USElang=EN-US style=font-size:12pt;ffective thermal management 올림픽 토토 high power LEDs is still one of
critical issues for the realization of the devices for general illum올림픽 토토ation and
ot올림픽 토토r applications which require high power operation. A great portion, more
than 80 %, of the drive 올림픽 토토put power to operate GaN-based LEDs is consumed 올림픽 토토
generat올림픽 토토g phonons rather than photons. 올림픽 토토 this paperstyle=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KO,lang=EN-US style=font-size:12pt; thermal packag올림픽 토토g schemes바탕;mso-fareast-language:KO will be discussedlang=EN-US style=font-size:12pt; from t올림픽 토토
package level to system level. 올림픽 토토 particular,style=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KOceramic packages
with different paths of thermal dissipation were designed by us올림픽 토토g thermal
simulator which utilizes f올림픽 토토ite volume method. It was shown that the thermal
characteristics of t올림픽 토토 LED packages were strongly affected by t올림픽 토토 contact area
of thermal via 올림픽 토토 contact with LED chip rather than that 올림픽 토토 contact with the
ceramic mold. Multi-chip sc올림픽 토토mes are also analyzed for t올림픽 토토rmally efficient LED
packag올림픽 토토g design.